US Patent Issued to Aeterlink on April 15 for "Device housing for wirelessly receiving power, and device having the same" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,498, issued on April 15, was assigned to Aeterlink Corp. (Tokyo).

"Device housing for wirelessly receiving power, and device having the same" was invented by Yuji Tanabe (Tokyo) and Naoto Kodate (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device housing is provided for wirelessly receiving electric power in order to supply electric power to a device with an excellent power-receiving efficiency, while suppressing an increase in its size as a whole. Also, a device having the same device housing and a device housing for constituting a main body of a device which is a sensor or an actuator are provided. The device housing is provided with a p...