US Patent Issued to AEM Singapore on March 25 for "Multiplexed thermal control wafer and coldplate" (American, Finnish Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,428, issued on March 25, was assigned to AEM Singapore Pte. Ltd. (Singapore).

"Multiplexed thermal control wafer and coldplate" was invented by Samer Kabbani (Laguna Niguel, Calif.), Taneli Veistinen (Lieto, Finland), Terry Sinclair Connacher (Tempe, Ariz.), Sami Mikola (Mynamaki, Finland), Thomas P. Jones (Stanwood, Mich.) and Ari Kuukkala (Turku, Finland).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are systems and methods for controlling temperature(s) using a thermal control assembly (TCA) and a coldplate. The TCA comprises independently controllable thermal zones for controlling its top surface temperature. The thermal zones ...