US Patent Issued to Advantest Test Solutions on Jan. 27 for "Wafer scale active thermal interposer for device testing" (California Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,522, issued on Jan. 27, was assigned to Advantest Test Solutions Inc. (San Jose, Calif.).

"Wafer scale active thermal interposer for device testing" was invented by Samer Kabbani (San Jose, Calif.), Paul Ferrari (San Jose, Calif.), Ikeda Hiroki (San Jose, Calif.), Kiyokawa Toshiyuki (San Jose, Calif.), Gregory Cruzan (San Jose, Calif.) and Karthik Ranganathan (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for use in testing an integrated circuit semiconductor wafer device under test (wafer DUT) includes a probe configured to probe a surface of the wafer DUT during testing thereof, a thermal interposer (TI) including a ...