US Patent Issued to Advantest Test Solutions on Feb. 3 for "Wafer scale active thermal interposer for device testing" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,968, issued on Feb. 3, was assigned to Advantest Test Solutions Inc. (San Jose, Calif.).

"Wafer scale active thermal interposer for device testing" was invented by Samer Kabbani (San Jose, Calif.), Paul Ferrari (San Jose, Calif.), Ikeda Hiroki (San Jose, Calif.), Kiyokawa Toshiyuki (San Jose, Calif.), Gregory Cruzan (San Jose, Calif.) and Karthik Ranganathan (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for testing circuits of an integrated circuit semiconductor wafer includes a thermal interposer (TI) device for use in testing circuits of a semiconductor device. The TI device includes a top surface configured to receive t...