US Patent Issued to ADVANTEST on Oct. 7 for "Temperature adjusting device, electronic component handling apparatus, and electronic component test apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,185, issued on Oct. 7, was assigned to ADVANTEST Corp. (Tokyo).

"Temperature adjusting device, electronic component handling apparatus, and electronic component test apparatus" was invented by Yuya Yamada (Tokyo), Aritomo Kikuchi (Tokyo) and Yasuyuki Kato (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temperature adjusting device includes: a fluid connector connected to a fluid supply source; a heat exchanger thermally connected to a DUT or a carrier holding the DUT being pressed against a socket; a first flow path passing through an inside of the heat exchanger; a first swirl flow forming part that supplies a first swirl flow to the first f...