US Patent Issued to ADVANTEST on Jan. 27 for "Semiconductor wafer testing apparatus, semiconductor wafer testing system, flatness measuring device, and method of adjusting flatness of wiring board" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,503, issued on Jan. 27, was assigned to ADVANTEST Corp. (Tokyo).

"Semiconductor wafer testing apparatus, semiconductor wafer testing system, flatness measuring device, and method of adjusting flatness of wiring board" was invented by Yuto Mori (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer testing apparatus tests a device under test (DUT) on a semiconductor wafer. The semiconductor wafer testing apparatus includes a first wiring board including first connectors and that is electrically connected to a probe card having probes that contact the DUT, second wiring boards each including a second connector configured to be fit...