US Patent Issued to Advanced Technical Ceramics on March 25 for "Selective metallization of integrated circuit packages" (Tennessee Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,123, issued on March 25, was assigned to Advanced Technical Ceramics Co. (Chattanooga, Tenn.).

"Selective metallization of integrated circuit packages" was invented by Aaron Fitzsimmons (Chattanooga, Tenn.) and William T. Minehan (Chattanooga, Tenn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase proces...