US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Sept. 9 for "Semiconductor packages and methods of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,845, issued on Sept. 9, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor packages and methods of manufacturing the same" was invented by Cheng Yuan Chen (Kaohsiung, Taiwan), Jiming Li (Kaohsiung, Taiwan), Chun Chen Chen (Kaohsiung, Taiwan) and Yuanhao Yu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding elemen...