US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Sept. 30 for "Electronic device package and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,453, issued on Sept. 30, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic device package and method for manufacturing the same" was invented by Mei-Ju Lu (Kaohsiung, Taiwan), Chi-Han Chen (Kaohsiung, Taiwan), Chang-Yu Lin (Kaohsiung, Taiwan), Jr-Wei Lin (Kaohsiung, Taiwan) and Chih-Pin Hung (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The seco...