US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Oct. 7 for "Semiconductor device package" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,128, issued on Oct. 7, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package" was invented by Shang-Ruei Wu (Kaohsiung, Taiwan), Chien-Yuan Tseng (Kaohsiung, Taiwan), Meng-Jen Wang (Kaohsiung, Taiwan), Chen-Tsung Chang (Kaohsiung, Taiwan), Chih-Fang Wang (Kaohsiung, Taiwan), Cheng-Han Li (Kaohsiung, Taiwan), Chien-Hao Chen (Kaohsiung, Taiwan), An-Chi Tsao (Kaohsiung, Taiwan) and Per-Ju Chao (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate...