US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Nov. 4 for "Semiconductor substrate, semiconductor package, method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,141, issued on Nov. 4, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor substrate, semiconductor package, method of manufacturing the same" was invented by Wen Hung Huang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate includes a substrate and a plurality of electronic components. The substrate defines a cavity. A total number of the electronic components is N, the electronic components are divided into M groups, M and N are positive integers, and M is smaller than N. The electronic components in each group are encapsulated by a first insulation layer to form a res...