ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,157, issued on Nov. 4, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).
"Electronic package" was invented by Meng-Wei Hsieh (Kaohsiung, Taiwan), Hung-Yi Lin (Kaohsiung, Taiwan), Hsu-Chiang Shih (Kaohsiung, Taiwan) and Cheng-Yuan Kung (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided. The electronic package includes an amplifier component, a control component, and a first circuit layer. The control component is disposed above the amplifier component. The first circuit layer is disposed between the amplifier component and the control component. The control component is config...