US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Nov. 25 for "Electronic package and suction device" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,694, issued on Nov. 25, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic package and suction device" was invented by Chun Hung Tsai (Kaohsiung, Taiwan), Chenghan She (Kaohsiung, Taiwan), Kuo-Chih Huang (Kaohsiung, Taiwan) and Kuan-Lin Yeh (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic comp...