US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on May 27 for "Wiring structure including low- and high-density conductive structures" (Taiwanese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,820, issued on May 27, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Wiring structure including low- and high-density conductive structures" was invented by Wen Hung Huang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion."

The patent was filed on Aug. 8, 2023, under Application No....