ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,785, issued on May 27, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).
"Semiconductor device package" was invented by Yu-Ying Lee (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the fi...