US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on May 27 for "Package substrate, electronic device package and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,828, issued on May 27, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Package substrate, electronic device package and method for manufacturing the same" was invented by Wu Chou Hsu (Kaohsiung, Taiwan), Chih-Cheng Lee (Kaohsiung, Taiwan), Min-Yao Chen (Kaohsiung, Taiwan) and Hsing Kuo Tien (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate, and the electronic component inc...