US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on May 13 for "Semiconductor package structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,602, issued on May 13, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor package structure and method for manufacturing the same" was invented by Yung-Shun Chang (Kaohsiung, Taiwan), Meng-Wei Hsieh (Kaohsiung, Taiwan) and Teck-Chong Lee (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a semiconductor die and at least one pillar structure. The semiconductor die has an upper surface and includes at least one conductive pad disposed adjacent to the upper surface. The pillar structure is electrically connected to the conductive pad of the semiconductor ...