ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,630, issued on May 13, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).
"Semiconductor device package structure comprising package unit including adhesive layer" was invented by Ming-Hung Chen (Kaohsiung, Taiwan) and Zheng Wei Wu (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion o...