US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on May 13 for "Semiconductor device package including stress buffering layer" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,677, issued on May 13, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package including stress buffering layer" was invented by Chien-Mei Huang (Kaohsiung, Taiwan), Shih-Yu Wang (Kaohsiung, Taiwan), I-Ting Lin (Kaohsiung, Taiwan), Wen Hung Huang (Kaohsiung, Taiwan), Yuh-Shan Su (Kaohsiung, Taiwan), Chih-Cheng Lee (Kaohsiung, Taiwan) and Hsing Kuo Tien (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, at...