US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on May 13 for "Electronic package and electronic device" (Taiwanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,681, issued on May 13, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic package and electronic device" was invented by Wei-Hao Chang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The ...