US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on May 13 for "Electronic device, package structure and electronic manufacturing method" (Taiwanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,651, issued on May 13, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic device, package structure and electronic manufacturing method" was invented by Pei-Jen Lo (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device, a package structure and an electronic manufacturing method are provided. The electronic device includes a substrate, a first bump, a second bump and a first reflowable material. The first bump is disposed over the substrate, and has a first width. An end portion of the first bump defines a first recess portion. The second bump is disposed over the substrate, and ha...