US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on March 25 for "Semiconductor device package and a method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,089, issued on March 25, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package and a method of manufacturing the same" was invented by Tsung-Yu Lin (Kaohsiung, Taiwan), Pei-Yu Wang (Kaohsiung, Taiwan) and Chung-Wei Hsu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel."

The patent was filed on J...