US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on June 3 for "Semiconductor package structure and semiconductor manufacturing process" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,672, issued on June 3, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor package structure and semiconductor manufacturing process" was invented by Ian Hu (Kaohsiung, Taiwan) and Cheng-Yu Tsai (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a semiconductor die, at least one wiring structure, a metal support, a passive element, a plurality of signal vias, and a plurality of thermal structures. The semiconductor die has an active surface. The at least one wiring structure is electrically connected to the active surface of the semiconductor die. The me...