US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on June 17 for "Electronic package and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,412, issued on June 17, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic package and method of forming the same" was invented by Chang-Lin Yeh (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided in the present disclosure. The electronic package comprises: an electronic component; a thermal conductive element above the electronic component, wherein thermal conductive element includes a first metal; an adhesive layer between the electronic component and the thermal conductive element, wherein the first adhesive layer includes a second metal; and an intermetallic co...