US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on July 29 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,631, issued on July 29, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package and method of manufacturing the same" was invented by Hsu-Chiang Shih (Kaohsiung, Taiwan), Hung-Yi Lin (Kaohsiung, Taiwan), Meng-Wei Hsieh (Kaohsiung, Taiwan), Yu Sheng Chang (Kaohsiung, Taiwan), Hsiu-Chi Liu (Kaohsiung, Taiwan) and Mark Gerber (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component....