US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on July 29 for "Semiconductor device package and acoustic device having the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,375,842, issued on July 29, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package and acoustic device having the same" was invented by Ming-Tau Huang (Kaohsiung, Taiwan), Kuei-Hao Tseng (Kaohsiung, Taiwan) and Hung-I Lin (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsula...