US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on July 29 for "Electronic package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,778, issued on July 29, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic package and method of manufacturing the same" was invented by Jenchun Chen (Kaohsiung, Taiwan) and Ya-Wen Liao (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electr...