US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on July 22 for "Electronic package" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,104, issued on July 22, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic package" was invented by Hung-Yi Lin (Kaohsiung, Taiwan) and Cheng-Yuan Kung (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided. The electronic package includes a first processing component, a second processing component, and a first memory unit. The first memory unit is over the first processing component and the second processing component. The first processing component and the second processing component are configured to access data stored in the first memory unit."

The patent was fil...