US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on July 15 for "Electronic structure having a protrusion structure disposed in a gap between a circuit pattern structure and a packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,316, issued on July 15, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic structure having a protrusion structure disposed in a gap between a circuit pattern structure and a packaging structure" was invented by Po-Jen Cheng (Kaohsiung, Taiwan), Wei-Jen Wang (Kaohsiung, Taiwan) and Fu-Yuan Chen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the pack...