US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Jan. 28 for "Electronic package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,780, issued on Jan. 28, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic package structure" was invented by Chiung-Ying Kuo (Kaohsiung, Taiwan) and Hung-Chun Kuo (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optic...