US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Jan. 27 for "Semiconductor package device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,419, issued on Jan. 27, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor package device and method of manufacturing the same" was invented by Ming-Ze Lin (Kaohsiung, Taiwan), Chia Ching Chen (Kaohsiung, Taiwan) and Yi Chuan Ding (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and th...