US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Jan. 27 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,817, issued on Jan. 27, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package and method of manufacturing the same" was invented by Cheng-Lin Ho (Kaohsiung, Taiwan) and Chih-Cheng Lee (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a substrate, and interconnection structure and a package body. The interconnection structure is disposed on the substrate. The interconnection structure has a conductive structure and a first dielectric layer covering a portion of the conductive structure. The conductive structure defines an antenna feeding point...