US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Jan. 20 for "Semiconductor device package and a method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,743, issued on Jan. 20, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package and a method of manufacturing the same" was invented by Peng Yang (Kaohsiung, Taiwan), Yuan-Feng Chiang (Kaohsiung, Taiwan) and Po-Wei Lu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor d...