US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Jan. 13 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,565, issued on Jan. 13, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package and method of manufacturing the same" was invented by Jung Jui Kang (Kaohsiung, Taiwan), Shih-Yuan Sun (Kaohsiung, Taiwan) and Chieh-Chen Fu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction ove...