US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Feb. 4 for "Semiconductor device package" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,077, issued on Feb. 4, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package" was invented by Cheng-Nan Lin (Kaohsiung, Taiwan), Ming-Chiang Lee (Kaohsiung, Taiwan) and Yung-I Yeh (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component....