US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Feb. 10 for "Method and equipment for manufacturing a package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,663, issued on Feb. 10, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Method and equipment for manufacturing a package structure" was invented by Hsing Kuo Tien (Kaohsiung, Taiwan) and Chih-Cheng Lee (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and equipment for manufacturing a package structure are disclosed. The equipment includes a first space, a de-bonding apparatus, a second space and a fluid supply device. The de-bonding apparatus is disposed in the first space, and configured to perform a de-bonding process. The second space is disposed around the first space. The fluid supply devi...