US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Dec. 9 for "Substrate structure including different size of electronic component" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,437, issued on Dec. 9, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Substrate structure including different size of electronic component" was invented by Wu Chou Hsu (Kaohsiung, Taiwan) and Min-Yao Chen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic ...