US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Dec. 9 for "Package structures and methods of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,446, issued on Dec. 9, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Package structures and methods of manufacturing the same" was invented by An-Hsuan Hsu (Kaohsiung, Taiwan) and Chin-Li Kao (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is disclosed. The package structure includes a substrate including a conductive element and a plurality of wires having a surface area through which heat of the conductive element can be dissipated, lowering a bonding temperature of the conductive element. The package structure also includes a conductive layer disposed between the conductive elem...