US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Dec. 9 for "Optoelectronic package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,655, issued on Dec. 9, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Optoelectronic package structure and method of manufacturing the same" was invented by Cheng-Hsuan Wu (Kaohsiung, Taiwan), Chang-Yu Lin (Kaohsiung, Taiwan) and Yu-Sheng Huang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking ...