US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Dec. 30 for "Method for manufacturing semiconductor package and apparatus for flattening workpiece" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,337, issued on Dec. 30, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Method for manufacturing semiconductor package and apparatus for flattening workpiece" was invented by Ya Fang Chan (Kaohsiung, Taiwan), Cong-Wei Chen (Kaohsiung, Taiwan), Kuoching Cheng (Kaohsiung, Taiwan) and Shih-Yu Wang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower s...