US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Dec. 23 for "Semiconductor package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,103, issued on Dec. 23, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor package structure and method of manufacturing the same" was invented by Yu-Pin Tsai (Kaohsiung, Taiwan), Ming-Chi Liu (Kaohsiung, Taiwan), Yu-Ting Lu (Kaohsiung, Taiwan), Kai-Chiang Hsu (Kaohsiung, Taiwan) and Che-Ting Liu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pi...