US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Dec. 16 for "Method for manufacturing semiconductor package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,205, issued on Dec. 16, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Method for manufacturing semiconductor package structure" was invented by Yi Dao Wang (Kaohsiung, Taiwan), Tung Yao Lin (Kaohsiung, Taiwan) and Rong He Guo (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a s...