US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Aug. 19 for "Semiconductor package structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,676, issued on Aug. 19, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor package structure and method for manufacturing the same" was invented by Chen-Chao Wang (Kaohsiung, Taiwan), Chih-Yi Huang (Kaohsiung, Taiwan) and Keng-Tuan Chang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the firs...