ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,001, issued on Aug. 12, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).
"Electronic package" was invented by Yu-Lin Shih (Kaohsiung, Taiwan) and Chih-Cheng Lee (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided. The electronic package includes a first circuit structure, a second circuit structure, and an underfill. The second circuit structure is disposed over the first circuit structure. The underfill is disposed between the first circuit structure and the second circuit structure. An inner portion of the underfill has an inner lateral surface adjacent to and is substanti...