US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on April 22 for "Optoelectronic device package and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,585, issued on April 22, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Optoelectronic device package and method of manufacturing the same" was invented by Chi-Han Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optoelectronic device package includes a first redistribution layer (RDL), a first electronic die disposed over the first RDL, wherein an active surface of the first electronic die faces the first RDL. The optoelectronic device package further includes a second electronic die disposed over the first RDL, and a photonic die disposed over and electrically connected to the second electronic ...