US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on April 22 for "Electronic package and method of forming the same" (American, Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,537, issued on April 22, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic package and method of forming the same" was invented by You-Lung Yen (Taoyuan, Taiwan) and Bernd Karl Appelt (Holly Springs, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through ...