US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on April 1 for "Semiconductor package device method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,644, issued on April 1, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor package device method of manufacturing the same" was invented by Chang-Yu Lin (Kaohsiung, Taiwan), Chi-Han Chen (Kaohsiung, Taiwan) and Chieh-Chen Fu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a sec...