US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on April 1 for "Package process and package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,632, issued on April 1, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Package process and package structure" was invented by Chi-Chih Shen (Kaohsiung, Taiwan), Jen-Chuan Chen (Kaohsiung, Taiwan) and Tommy Pan (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact...