US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on April 1 for "Embedded component package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,267,961, issued on April 1, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Embedded component package structure and manufacturing method thereof" was invented by Chien-Fan Chen (Kaohsiung, Taiwan) and Chien-Hao Wang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies f...