US Patent Issued to ADVANCED OPTOELECTRONIC TECHNOLOGY on March 25 for "Optical packaging structure and backlight module having the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,110, issued on March 25, was assigned to ADVANCED OPTOELECTRONIC TECHNOLOGY INC. (Hsinchu County, Taiwan).

"Optical packaging structure and backlight module having the same" was invented by Chuang-Yu Hsieh (Hsinchu, Taiwan), Hsin-Ting Hung (Hsinchu, Taiwan), Hao-Hsiang Hsieh (Hsinchu, Taiwan) and Shih-Hsiang Lo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light...